Samsung patents antenna design using housing as part of circuit
Samsung describes an antenna built into a printed circuit board inside a device housing. The design uses specific metal patterns that connect to different parts of the outer shell to help the antenna function.
In the filing’s own words
According to an embodiment, an electronic device includes a housing including a first surface and a second surface opposite to the first surface, and an antenna including a printed circuit board (PCB) positioned between the first surface and the second surface. The PCB includes a feed pattern including a first connector region, and a ground pattern including a first ground region in contact with a first portion of the first surface, a first coupling region connected to the first ground region, a second ground region connected to the first coupling region and including a second connector region, and a second coupling region connected to the second ground region and in contact with a second portion different from the first portion of the first surface.
What exactly they claim (claim 1)
1. An electronic device, comprising: a housing comprising a first surface and a second surface opposite to the first surface; and an antenna comprising a printed circuit board (PCB) positioned between the first surface and the second surface, wherein the PCB comprises: a feed pattern comprising a first connector region; and a ground pattern comprising a first ground region in contact with a first portion of the first surface, a first coupling region connected to the first ground region, a second ground region connected to the first coupling region and comprising a second connector region, and a second coupling region connected to the second ground region and in contact with a second portion of the first surface, wherein the second portion of the first surface is different from the first portion of the first surface.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Antenna and electronic device including the same
- Patent number
- US12756091B2
- Application number
- 18120921
- Filed
- Mar 13, 2023
- Granted
- Oct 6, 2026
- Inventors
- 8
- Claims
- 23
Classified under
H01Q 1/48 Electricity & electronicsH01Q 1/2266 Electricity & electronicsH01Q 5/307 Electricity & electronicsH01Q 9/0457 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.