Samsung patents heat pump control that adjusts valve opening for efficiency
This patent describes a heat pump system that uses sensors to monitor water temperature and refrigerant pressure. A controller compares these readings to adjust how much the expansion valve opens, ensuring the refrigerant condenses at the right temperature.
In the filing’s own words
A heat pump system according to an aspect of the disclosure may comprise: a compressor configured to compress a refrigerant; a water heat exchanger configured to exchange heat between the compressed refrigerant and introduced water; an expansion valve configured to expand the refrigerant condensed in the water heat exchanger; an outdoor heat exchanger configured to exchange heat between the refrigerant expanded by the expansion valve and outdoor air; a high-tension pressure sensor configured to detect the temperature of the refrigerant to be condensed in the water heat exchanger; a discharged water temperature sensor configured to detect the temperature of water on which heat exchange has been performed in the water heat exchanger; and a control unit including a controller comprising circuitry configured to: determine a target condensation temperature of the refrigerant based on a detection result of the discharged water temperature sensor, compare the target condensation temperature with the current condensation temperature detected by the high-tension pressure sensor, and control the degree of opening of the expansion valve based on the comparison result.
What exactly they claim (claim 1)
1. A heat pump system comprising: a compressor configured to compress a refrigerant; a water heat exchanger configured to exchange heat between the compressed refrigerant and input water to condense the refrigerant; an expansion valve configured to expand the refrigerant after the refrigerant has been condensed in the water heat exchanger; an outdoor heat exchanger configured to exchange heat between the refrigerant expanded in the expansion valve and outdoor air; a high-pressure pressure sensor configured to detect a pressure of the refrigerant discharged by the compressor; a water output temperature sensor configured to detect a temperature of water having undergone heat exchange in the water heat exchanger; and a controller including at least one processor, comprising processing circuitry, and the at least one processor being individually and/or collectively configured to: determine a target condensation temperature of the refrigerant based on a result of detecting of the water output temperature sensor, determine a current condensation temperature by converting the pressure detected by the high-pressure pressure sensor into a saturation temperature, compare the target condensation temperature with the current condensation temperature, and control an opening degree of the expansion valve based on a result of comparing the target condensation temperature with the current condensation temperature.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Heat pump system and control method thereof
- Patent number
- US12753957B2
- Application number
- 18802836
- Filed
- Aug 13, 2024
- Granted
- Oct 6, 2026
- Inventors
- 4
- Claims
- 15
Classified under
F25B 41/31 Mechanical engineeringF25B 13/00 Mechanical engineeringMore from Samsung in Batteries & energy
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.