Samsung patents adhesive film that stays flexible in extreme heat and cold
Samsung has been granted a patent for a specific type of adhesive film designed to maintain consistent flexibility across a wide temperature range, from -20°C to 80°C. The invention uses a copolymer with a very low glass transition temperature to ensure the glue does not become brittle in the cold or overly soft in the heat. This material is intended for use in display members, such as screens in electronic devices.
In the filing’s own words
An adhesive film has an average slope of about −9.9 to about 0, as measured over a temperature range of about −20° C. to about 80° C. in a graph depicting a temperature-dependent storage modulus distribution of the adhesive film where the x-axis represents temperature (° C.) and the y-axis represents storage modulus (kPa). The adhesive film also has a storage modulus at about 80° C. of about 10 kPa to about 1,000 kPa.
What exactly they claim (claim 1)
1. An adhesive film having an average slope of −5.0 to 0, as measured over a temperature range of −20° C. to 80° C. in a graph of storage modulus versus temperature in which the x-axis represents temperature (C) and the y-axis represents the storage modulus (kPa), and the adhesive film having a storage modulus at 80° C. of 10 kPa to 1,000 kPa and a storage modulus at 25° C. of 10 kPa to 70 kPa, wherein the adhesive film is formed from an adhesive composition that includes a hydroxyl group-containing (meth)acrylic copolymer having a glass transition temperature of about −150° C. to about −13° C., and wherein a monomer mixture configured to form the hydroxyl group-containing (meth)acrylic copolymer comprises a comonomer, a homopolymer of the comonomer has a glass transition temperature of −150° C. to 0° C., and the comonomer comprises alkyl (meth)acrylate monomers.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Adhesive composition, adhesive film prepared from the same and display member including the same
- Patent number
- US12753329B2
- Application number
- 17682749
- Filed
- Feb 28, 2022
- Granted
- Oct 6, 2026
- Inventors
- 12
- Claims
- 30
Classified under
C09J 7/10 Chemistry & metalsC08L 53/02 Chemistry & metalsC09J 7/00 Chemistry & metalsC09J 7/22 Chemistry & metalsC09J 7/38 Chemistry & metalsC09J 133/066 Chemistry & metalsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.