Samsung patents chip polishing tool with ultrasonic debris cleaner
Samsung has been granted a patent for a device used in making computer chips that cleans the surface of a polishing pad. The tool uses a liquid injector to dilute the polishing fluid and an ultrasonic emitter to vibrate away small pieces of debris created during the process.
In the filing’s own words
Provided is a conditioner including a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry, a conditioning disk on the conditioning arm that is configured to condition the polishing pad, a dilution solution injector on a first side of the conditioning arm and configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk, and a sonicator on a second side of the conditioning arm and configured to apply an ultrasonic wave to debris generated from the polishing pad.
What exactly they claim (claim 1)
1. A conditioner comprising: a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry; a conditioning disk on the conditioning arm that is configured to condition the polishing pad; a dilution solution injector on a first side of the conditioning arm and configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk; and a sonicator on a second side of the conditioning arm and configured to apply an ultrasonic wave to debris generated from the polishing pad, wherein the dilution solution injector and the sonicator are provided on a same plane parallel to an upper surface of the polishing pad and spaced apart and separated from each other in a direction parallel to the upper surface of the polishing pad, and wherein the dilution solution injector is provided on the first side of the conditioning arm and the sonicator is provided on the second side of the conditioning arm opposite to the first side with respect to a rotation direction of the polishing pad.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Conditioner and chemical mechanical polishing apparatus including the same
- Patent number
- US12752393B2
- Application number
- 18214857
- Filed
- Jun 27, 2023
- Granted
- Oct 6, 2026
- Inventors
- 2
- Claims
- 20
Classified under
B24B 53/12 Operations & transportB24B 1/04 Operations & transportB24B 53/017 Operations & transportMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.