Samsung patents chip stacking method using insulating film
Samsung has been granted a patent for a specific way to stack computer chips using a non-conductive film to bond them together. The design includes layers of molding material that surround the chips and the film, ensuring the sides of the film and the inner molding layer are perfectly flat with each other.
In the filing’s own words
A semiconductor package includes: a buffer die; a first core die disposed on the buffer die; a second core die disposed on the first core die; a first non-conductive film (NCF) disposed between the first core die and the second core die and bonding the first core die and the second core die to each other; a first molding layer at least partially surrounding a side surface of the first core die; and a second molding layer surrounding the first NCF and the first molding layer, wherein the first core die, the second core die, and the buffer die are disposed on the second molding layer, wherein a side surface of the first molding layer and a side surface of the first NCF form a coplanar surface.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a buffer die; a first core die disposed on the buffer die; a second core die disposed on the first core die; a first non-conductive film (NCF) disposed between the first core die and the second core die and configured for thermocompression bonding the first core die and the second core die to each other; a first molding layer at least partially surrounding a side surface of the first core die; and a second molding layer surrounding the first NCF and the first molding layer, wherein the first core die, the second core die, and the buffer die are disposed on the second molding layer, wherein a side surface of the first molding layer and a side surface of the first NCF form a coplanar surface.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor package manufactured through a thermocompression process using a non-conductive film (NCF)
- Patent number
- US12751324B2
- Application number
- 18217649
- Filed
- Jul 3, 2023
- Granted
- Sep 29, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 90/00 Electricity & electronicsH10W 74/121 Electricity & electronicsH10W 72/0198 Electricity & electronicsH10W 72/07332 Electricity & electronicsH10W 74/15 Electricity & electronicsH10W 90/297 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.