Samsung patents chip package with carbon layer for better protection
Samsung has been granted a patent for a specific design of semiconductor packages, which are the protective housings for computer chips. The design includes a layer made of carbonized material placed between the chip's internal wiring and an outer protective coating. This structure aims to improve how the package handles stress or environmental factors by using this specific material arrangement.
In the filing’s own words
The present disclosure relates to semiconductor packages. An example semiconductor package includes a substrate including an active surface and an inactive surface, a plurality of wiring structures arranged on the active surface of the substrate, an inter-wiring insulating layer arranged on the active surface of the substrate and configured to cover the plurality of wiring structures, a modified layer including both side surfaces thereof covered by the inter-wiring insulating layer and including a carbonized material, and a passivation layer arranged on the inter-wiring insulating layer and the modified layer.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a substrate including an active surface and an inactive surface; a plurality of wiring structures arranged on the active surface of the substrate; an inter-wiring insulating layer arranged on the active surface of the substrate and covering the plurality of wiring structures; a modified layer including a first side surface and a second side surface thereof covered by the inter-wiring insulating layer and including a carbonized material; and a passivation layer arranged on the inter-wiring insulating layer and the modified layer.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor package with a carbonized modified layer covered by a passivation layer
- Patent number
- US12751280B2
- Application number
- 18612137
- Filed
- Mar 21, 2024
- Granted
- Sep 29, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 20/435 Electricity & electronicsH10W 20/20 Electricity & electronicsH10W 20/48 Electricity & electronicsH10W 70/095 Electricity & electronicsH10W 72/30 Electricity & electronicsH10W 72/851 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.