Samsung patents tray design to hold and guide semiconductor chips
This filing describes a physical tray used to store and organize semiconductor wafers or chips. It features curved channels that guide the chips into specific slots, ensuring they are held securely in place.
In the filing’s own words
A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.
What exactly they claim (claim 1)
1. A module tray for a semiconductor device, the module tray comprising: a base plate; first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space; a dividing wall extending in the vertical direction from the base plate, the dividing wall being between the first and second sidewalls, and separating the accommodation space into a first accommodation space and a second accommodation space; first to fourth fastening guides provided on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, respectively, the first to fourth fastening guides having first to fourth fastening grooves, respectively, and the first to fourth fastening grooves extending in the vertical direction to accommodate opposite ends of semiconductor substrates, respectively; and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes to respectively guide the semiconductor substrates into the first to fourth fastening guides, respectively, wherein the first to fourth guide grooves are above the first to fourth fastening grooves, respectively.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Module tray for semiconductor device
- Patent number
- US12751243B2
- Application number
- 18962104
- Filed
- Nov 27, 2024
- Granted
- Sep 29, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10P 72/1908 Electricity & electronicsH10P 72/1904 Electricity & electronicsH10P 72/1922 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.