Samsung patents chamber that pumps air in and out to fix chip glue
Samsung has been granted a patent for a machine that removes air bubbles from the glue used to hold computer chips in place. The device works by placing the chip in a sealed chamber and repeatedly pumping in hot gas and sucking out air to squeeze the bubbles out of the material.
In the filing’s own words
A device for removing a void in an underfill material is described. The device includes a chamber configured to accept a substrate applied with an underfill material therein; a gas supply device connected to the chamber and configured to inject a heated gas into the chamber to create a heating atmosphere and a pressurizing atmosphere inside the chamber; and a vacuum device connected to the chamber and configured to exhaust a gas to the outside of the chamber to create a vacuum atmosphere inside the chamber. The vacuum device and the gas supply device are configured to alternately operate once during each cycle of one or more cycles to create the vacuum atmosphere and the pressurizing atmosphere inside the chamber, and during each cycle of the one or more cycles, the vacuum device and the gas supply device are configured to alternately operate once. Related methods are also described.
What exactly they claim (claim 1)
1. A device for removing a void in an underfill material, the device comprising: a chamber configured to accept a substrate applied with an underfill material therein; a gas supply device connected to the chamber and configured to inject a heated gas into the chamber to create a heating atmosphere and a pressurizing atmosphere inside the chamber; and a vacuum device connected to the chamber and configured to exhaust a gas from the inside of the chamber to outside of the chamber to create a vacuum atmosphere inside the chamber, wherein the vacuum device and the gas supply device are configured to alternately operate for one or more cycles to create the vacuum atmosphere and the pressurizing atmosphere inside the chamber, and during each cycle of the one or more cycles, the vacuum device and the gas supply device are configured to alternately operate once.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Device for removing void in underfill material
- Patent number
- US12751238B2
- Application number
- 18800266
- Filed
- Aug 12, 2024
- Granted
- Sep 29, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10P 72/0441 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.