Samsung patents method for safely moving silicon wafers
The filing describes a process for moving silicon wafers by sealing them in a container filled with nitrogen gas. The container is then wrapped in vinyl and a logistics bag before being moved to a climate-controlled room. This setup keeps the wafers at a specific temperature and low humidity during transport.
In the filing’s own words
A method of transporting a semiconductor is provided and includes: providing an accommodation container accommodating a wafer and including nitrogen gas to a packaging chamber; performing, in the packaging chamber, a first packaging on the accommodation container by packaging the accommodation container with vinyl; performing a second packaging on the accommodation container, on which the first packaging has been performed, by packaging the accommodation container with a logistics bag; transporting the accommodation container to a standby chamber and standing by the accommodation container in the standby chamber; and transporting the accommodation container that was in standby in the standby chamber by using a transporter in the transport chamber. A temperature of the standby chamber, in which the accommodation container is in standby, is maintained in a range of 18° C. to 23.5° C., and a humidity of the standby chamber is maintained in a range of 0% to 45%.
What exactly they claim (claim 1)
1. A method of transporting a semiconductor, the method comprising: providing an accommodation container accommodating a wafer and including nitrogen gas to a packaging chamber; performing, in the packaging chamber, a first packaging on the accommodation container by packaging the accommodation container with vinyl; performing a second packaging on the accommodation container, on which the first packaging has been performed, by packaging the accommodation container with a logistics bag; transporting the accommodation container, on which the first packaging and the second packaging have been performed, to a standby chamber and standing by the accommodation container in the standby chamber; and transporting the accommodation container that was in standby in the standby chamber by using a transporter in a transport chamber, wherein an internal temperature of the standby chamber, in which the accommodation container is in standby, is maintained in a range of 18° C. to 23.5° C., and an internal humidity of the standby chamber is maintained in a range of 0% to 45%.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor transport system and method of transporting semiconductor
- Patent number
- US12751232B2
- Application number
- 18404333
- Filed
- Jan 4, 2024
- Granted
- Sep 29, 2026
- Inventors
- 8
- Claims
- 16
Classified under
H10P 72/00 Electricity & electronicsB65B 11/58 Operations & transportB65B 51/00 Operations & transportB65B 57/00 Operations & transportMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.