Samsung patents chip-making step using carbon mask layer
Samsung has been granted a patent for a specific method to build semiconductor devices. The process involves creating a two-part mask layer, where the bottom layer contains carbon, to help form a protective liner on the sides of a hole during manufacturing.
In the filing’s own words
A for fabricating a semiconductor device comprises forming a mask layer on a substrate, the mask layer defining a through hole that exposes an upper surface of the substrate, the mask layer comprising a first mask layer and a second mask layer, wherein the second mask layer is between the substrate and the first mask layer, and wherein the second mask layer comprises carbon. The method includes forming a liner layer on side walls of the through hole inside the second mask layer.
What exactly they claim (claim 1)
1. A method for fabricating a semiconductor device, the method comprising: forming a mask layer on a substrate, the mask layer defining a through hole that exposes an upper surface of the substrate, the mask layer comprising a first mask layer and a second mask layer, wherein the second mask layer is between the substrate and the first mask layer, and wherein the second mask layer comprises carbon; and forming a liner layer on side walls of the through hole inside the second mask layer, wherein the liner layer is not on side walls of the through hole inside the first mask layer.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Method for fabricating semiconductor device
- Patent number
- US12751222B2
- Application number
- 18476390
- Filed
- Sep 28, 2023
- Granted
- Sep 29, 2026
- Inventors
- 8
- Claims
- 20
Classified under
H10P 14/61 Electricity & electronicsH10P 14/6339 Electricity & electronicsH10P 50/242 Electricity & electronicsH10P 76/20 Electricity & electronicsH10P 76/405 Electricity & electronicsH10P 76/4085 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.