SamsungGranted patentChips & hardwareInterest 4/10

Samsung patents chip design using flat materials and metal islands

The filing describes a semiconductor device that uses a thin, flat material layer as a base. It places small, separate metal islands on this layer and then covers them with a different type of metal to create the final structure.

Why it mattersThis is a detailed manufacturing technique for building computer chips, which may help improve how these components are made, though it does not describe a specific new product.

In the filing’s own words

A semiconductor device may include a two-dimensional material layer, one or more metal islands on the two-dimensional material layer, and a metal layer covering the metal islands on the two-dimensional material layer. The semiconductor device may be manufactured by a method including forming metal islands on a two-dimensional material layer using a redox method and forming a metal layer covering the metal islands on the two-dimensional material layer.

What exactly they claim (claim 1)

1. A semiconductor device comprising: a two-dimensional material layer; a plurality of metal islands spaced apart from each other on the two-dimensional material layer; and a metal layer covering the plurality of metal islands on the two-dimensional material layer and being in contact with the two-dimensional material layer, wherein the plurality of metal islands and the metal layer include different metals from each other.

Facts

Company: Samsung (Samsung Electronics Co., Ltd.)
Official title: Semiconductor device including two-dimensional material and method of manufacturing the same
Patent number: US12751046B2
Application number: 18152976
Filed: Jan 11, 2023
Granted: Sep 29, 2026
Inventors: 5
Claims: 16

Classified under

H10D 30/6729 Electricity & electronicsH10D 64/01 Electricity & electronicsH10D 64/62 Electricity & electronicsH10B 12/31 Electricity & electronicsH10B 53/30 Electricity & electronicsH10B 61/22 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.