Samsung patents chip layer with specific impurity layout
Samsung has been granted a patent for a semiconductor device structure that includes a specific arrangement of impurities within a dielectric layer. The design features two distinct sections where the concentration of these impurities decreases as the layer gets closer to the underlying semiconductor pattern.
In the filing’s own words
A semiconductor device includes a semiconductor pattern, a dielectric layer on the semiconductor pattern, and a conductive pattern on the dielectric layer. Each of the semiconductor pattern and the dielectric layer includes impurities. The dielectric layer includes a concentration profile of impurities including a first variation section including a first concentration of impurities decreasing throughout the dielectric layer toward the semiconductor pattern, and a second variation section including a second concentration of impurities decreasing throughout the dielectric layer toward the semiconductor pattern.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a semiconductor pattern; a dielectric layer on the semiconductor pattern; and a conductive pattern on the dielectric layer, wherein each of the semiconductor pattern and the dielectric layer includes impurities, and wherein the dielectric layer includes a concentration profile of impurities including a first variation section including a first concentration of impurities decreasing throughout the dielectric layer toward the semiconductor pattern, and a second variation section including a second concentration of impurities decreasing throughout the dielectric layer toward the semiconductor pattern, wherein the second variation section is located between the dielectric layer and the semiconductor pattern.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Semiconductor device
- Patent number
- US12750999B2
- Application number
- 18619490
- Filed
- Mar 28, 2024
- Granted
- Sep 29, 2026
- Inventors
- 6
- Claims
- 20
Classified under
H10B 12/315 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.