Google patents heat spreaders for mesh network devices
Google has been granted a patent for a cooling system designed for mesh network nodes. The setup uses a heat sink and spreaders to move heat from internal chips to the device's outer housing, allowing the heat to dissipate into the room.
In the filing’s own words
This document describes a thermal-control system ( 110) that may be integrated into a mesh network device ( 102) and associated mesh network devices. The thermal-control system ( 110), which may include a heat sink ( 112), multiple heat spreaders ( 114, 118), and a heat shield ( 116), is such that heat ( 106) originating from IC devices populating a printed circuit board ( 104) of the mesh network device ( 102) may be transferred to a housing component ( 108) of the mesh network device ( 102) for external dissipation to maintain a desired thermal profile of the mesh network device ( 102).
What exactly they claim (claim 1)
1. An apparatus comprising: a printed circuit board populated with one or more integrated circuit devices; a thermal-control system configured to transfer heat generated by the one or more integrated circuit devices to a housing component of the apparatus for external dissipation, the thermal-control system comprising: a heat sink, the heat sink centered about a central axis, the heat sink in thermal contact with at least one of the one or more integrated circuit devices; a first heat spreader, the first heat spreader attached to a first surface of the heat sink; a heat shield, the heat shield facing a second surface of the heat sink that is opposite the first surface; and a second heat spreader, the second heat spreader located between the heat shield and the printed circuit board, the printed circuit board located between the heat shield and the second surface of the heat sink.
Facts
- Company
- Google (Google LLC)
- Official title
- Thermal-control system of a mesh network device and associated mesh network devices
- Patent number
- US12750945B2
- Application number
- 18623538
- Filed
- Apr 1, 2024
- Granted
- Sep 29, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H05K 1/0203 Electricity & electronicsH05K 7/202 Electricity & electronicsH05K 7/20509 Electricity & electronicsH05K 9/0024 Electricity & electronicsH05K 7/20154 Electricity & electronicsH05K 7/2039 Electricity & electronicsMore from Google in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.