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MicrosoftGranted patentChips & hardwareInterest 6/10

Microsoft patents chip modules that snap together like building blocks

Microsoft describes a way to connect multiple small computer chips (called dies) using standardized, interchangeable link modules. These modules all have the same size and shape, allowing engineers to mix and match them to adjust data speed and fit different chip edges.

Why it mattersThis approach could make it easier for chipmakers to design flexible processors by using reusable connection parts instead of custom wiring for every new chip layout.

In the filing’s own words

Multi-die systems with modular die-to-die link macros for enabling die-to-die communication are described. A multi-die system includes a first die comprising a first set of modular die-to-die (D2D) transmit link macros and a first set of modular D2D receive link macros. The multi-die system further includes a second die, coupled to the first die via die-to-die (D2D) links, comprising a second set of modular D2D transmit link macros and a second set of modular D2D receive link macros. Each of the transmit/receive macros has the same physical shape, size, and the bandwidth capacity. The modularity associated with respective modular D2D transmit link macros and respective modular D2D receive link macros allows different combinations of an amount of bandwidth for data being transmitted or received via the D2D links and different amounts of edge depths for the first die and the second die along the die edge.

What exactly they claim (claim 1)

1. A multi-die system comprising: a first die comprising: (1) a first set of modular die-to-die (D2D) transmit link macros, wherein each of the first set of modular D2D transmit link macros has a same physical shape, size, and a bandwidth capacity, and (2) a first set of modular D2D receive link macros, wherein each of the first set of modular D2D receive link macros has the same physical shape, size, and the bandwidth capacity as each of the first set of modular D2D transmit link macros; and a second die, coupled to the first die via die-to-die (D2D) links, comprising: (1) a second set of modular D2D transmit link macros, wherein each of the second set of modular D2D transmit link macros has the same physical shape, size, and the bandwidth capacity as each of the first set of modular D2D transmit link macros, and (2) a second set of modular D2D receive link macros, wherein each of the second set of modular D2D receive link macros has the same physical shape, size, and the bandwidth capacity as each of the first set of modular D2D transmit link macros, wherein the first die has a die edge facing the second die, and wherein modularity associated with respective modular D2D transmit link macros and respective modular D2D receive link macros allows different combinations of an amount of bandwidth for data being transmitted or received via the D2D links across the die edge and different amounts of edge depths for the first die and the second die in a first direction parallel to the die edge.

Facts

Company
Microsoft (Microsoft Technology Licensing, LLC)
Official title
Multi-die systems with modular die-to-die link macros for enabling die-to-die communication
Patent number
US12748713B2
Application number
18740224
Filed
Jun 11, 2024
Granted
Sep 29, 2026
Inventors
11
Claims
20

Classified under

G06F 13/4027 Physics & computingG06F 2213/40 Physics & computing
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.