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SamsungGranted patentChips & hardwareInterest 3/10

Samsung patents tube design to improve chip coating uniformity

Samsung has been granted a patent for a vertical tube used in making computer chips. The tube has a varying width, being wider at the top where the chips sit, to help gas flow evenly around the wafers.

Why it mattersThis design tweak aims to make the chemical coating process more consistent across the entire surface of a chip, which is a standard goal in semiconductor manufacturing.

In the filing’s own words

A substrate processing apparatus may include an inner tube providing a process space extending vertically, an outer tube enclosing the inner tube, a gas supplying conduit connected to the process space, and a boat configured to be disposed in the process space. A first inner diameter of the inner tube at a first position may be different from a second inner diameter of the inner tube at a second position, and a level of the second position may be higher than a level of the first position.

What exactly they claim (claim 1)

1. A substrate processing apparatus, comprising: an inner tube providing a process space extending vertically; an outer tube enclosing the inner tube; a gas supplying conduit connected to the process space; and a boat configured to be disposed in the process space, wherein a first inner diameter of the inner tube at a first position is different from a second inner diameter of the inner tube at a second position, wherein a level of the second position is higher than a level of the first position, and wherein, in a horizontal cross-section at the second position, an inner circumference of the inner tube has a circular shape along an entire perimeter of the inner tube, and wherein the level of the second position is within a vertical extent of the boat.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
Substrate processing tube, substrate processing apparatus including the same, and substrate processing method using the apparatus
Patent number
US12747497B2
Application number
18125435
Filed
Mar 23, 2023
Granted
Sep 29, 2026
Inventors
5
Claims
20

Classified under

C23C 16/45502 Chemistry & metalsC23C 16/4583 Chemistry & metalsC23C 16/46 Chemistry & metalsH10P 72/14 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.