Samsung patents ring design to improve chip polishing
This patent describes a specific shape for a ring used in machines that smooth out silicon wafers. The ring has a curved channel on its bottom that helps guide the liquid slurry used to polish the surface evenly.
In the filing’s own words
Provided is a retainer ring, a chemical mechanical polishing apparatuses including the same, and a substrate polishing method using the same. A slurry groove is upwardly recessed from a bottom surface of the retainer ring. The slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface of the retainer ring. A curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove.
What exactly they claim (claim 1)
1. A retainer ring for chemical mechanical polishing, comprising: a slurry groove upwardly recessed from a bottom surface of the retainer ring, wherein the slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface of the retainer ring, wherein a curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove, and wherein the curvature radius of the slurry groove is greater than a radius of the inner surface.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method
- Patent number
- US12746638B2
- Application number
- 18229026
- Filed
- Aug 1, 2023
- Granted
- Sep 29, 2026
- Inventors
- 2
- Claims
- 19
Classified under
B24B 37/32 Operations & transportB24B 57/02 Operations & transportB24B 37/30 Operations & transportMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.