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Samsung patents chip package design using larger solder balls for stability

Samsung has been granted a patent for a specific way to build semiconductor packages, which are the protective shells that hold computer chips. The design uses a 'redistribution substrate' to connect the chip to the base, utilizing one or more larger 'core balls' alongside smaller standard solder balls to create electrical connections.

Why it mattersThis is a routine improvement in chip manufacturing that focuses on the physical structure of the package, likely aiming to improve reliability or heat management without changing the chip's function.

In the filing’s own words

A semiconductor package includes a package substrate, substrate pads provided on a top surface of the package substrate, at least one core ball on at least one of the substrate pads, a redistribution substrate provided on the top surface of the package substrate, and a semiconductor chip mounted on the redistribution substrate. The redistribution substrate is electrically connected to the package substrate through a plurality of solder balls provided on a bottom surface of the redistribution substrate. The at least one core ball is electrically connected to the redistribution substrate. A diameter of the at least one core ball is greater than a diameter of each of the plurality of solder balls.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a package substrate; a plurality of substrate pads on a top surface of the package substrate; at least one core ball on at least one of the plurality of substrate pads; a redistribution substrate on the top surface of the package substrate; and a semiconductor chip mounted on the redistribution substrate, wherein the redistribution substrate is electrically connected to the package substrate by a plurality of solder balls on a bottom surface of the redistribution substrate, wherein the at least one core ball is electrically connected to the redistribution substrate, wherein a diameter of the at least one core ball is greater than a diameter of each of the solder balls, and wherein the at least one core ball is between at least two of the plurality of solder balls.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
Semiconductor package and method of manufacturing the same
Patent number
US12745684B2
Application number
18174992
Filed
Feb 27, 2023
Granted
Sep 22, 2026
Inventors
3
Claims
20

Classified under

H10W 90/701 Electricity & electronicsH10W 74/111 Electricity & electronicsH10W 70/09 Electricity & electronicsH10W 70/60 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/724 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.