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Samsung patents chip package design to stop warping

Samsung has been granted a patent for a semiconductor package that uses a support member to hold an interposer flat against a chip. This structure prevents the interposer from bending or warping, which helps maintain the reliability of the connection between the chip and the rest of the device.

Why it mattersThis is a routine hardware improvement that helps ensure chips stay connected properly over time, which is important for the long-term stability of devices.

In the filing’s own words

There is provided a semiconductor package in which warpage of an interposer is prevented to improve product reliability. The semiconductor package includes a first substrate including a first insulating layer, and a first conductive pattern disposed in the first insulating layer, a semiconductor chip disposed on the first substrate, an interposer disposed on the semiconductor chip, wherein the interposer includes a second insulating layer, and a second conductive pattern disposed in the second insulating layer, a support member disposed on a bottom surface of the second insulating layer and in contact with an upper surface of the semiconductor chip, wherein the support member includes a first lower pad and a bump disposed under the first lower pad and a first connection member disposed between the first substrate and the interposer so as to connect the first conductive pattern and the second conductive pattern to each other.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a first substrate including a first insulating layer, and a first conductive pattern disposed in the first insulating layer; a semiconductor chip disposed on the first substrate; an interposer disposed on the semiconductor chip, wherein the interposer includes a second insulating layer, and a second conductive pattern disposed in the second insulating layer; a support member disposed on a bottom surface of the second insulating layer and contacting an upper surface of the semiconductor chip, wherein the support member includes a first lower pad and a bump disposed under the first lower pad; and a first connection member disposed between the first substrate and the interposer and connecting the first conductive pattern to the second conductive pattern.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
Semiconductor package including support member
Patent number
US12745643B2
Application number
18241531
Filed
Sep 1, 2023
Granted
Sep 22, 2026
Inventors
1
Claims
19

Classified under

H10W 42/121 Electricity & electronicsH10B 80/00 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/117 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/401 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.