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SamsungGranted patentChips & hardwareInterest 2/10

Samsung patents bracket that scrapes coating off circuit board mounts

Samsung has been granted a patent for a specific way to secure a circuit board inside an electronic device. The design uses a mounting bracket with small protrusions that scrape away a protective coating on the case when the board is installed. This ensures a direct metal-to-metal connection between the board and the case.

Why it mattersThis is a minor manufacturing detail that improves electrical grounding or heat transfer, but it is unlikely to change how users interact with their devices.

In the filing’s own words

An electronic device includes: a printed circuit board on which an electronic component is mounted; a case comprising a board mounting portion, on which the printed circuit board is mounted, the board mounting portion comprising an interference wall; and a mounting member fixed to the printed circuit board and configured to fix the printed circuit board to the board mounting portion, the mounting member including an interference portion configured to interfere with the interference wall and a scratch protrusion protruding from the interference portion and configured to scratch an outer surface of the interference wall in a state in which to the interference portion interferes with the interference wall.

What exactly they claim (claim 1)

1. An electronic device comprising: a printed circuit board on which an electronic component is mounted; a case comprising a board mounting portion on which the printed circuit board is mounted, the board mounting portion comprising an interference wall; and a mounting member fixed to the printed circuit board and configured to fix the printed circuit board to the board mounting portion, the mounting member comprising an interference portion configured to interfere with the interference wall and a scratch protrusion protruding from the interference portion and configured to scratch an outer surface of the interference wall in a state in which the interference portion interferes with the interference wall, wherein the interference portion comprises a through-hole facing the interference wall, wherein the scratch protrusion has a circumference corresponding to a circumference of the through-hole, wherein the interference wall comprises a coating layer on the outer surface of the interference wall, and wherein the scratch protrusion is configured to remove at least a portion of the coating layer in a state in which the interference portion interferes with the interference wall.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Mounting bracket and electronic device and display apparatus including the same
Patent number
US12745360B2
Application number
18786098
Filed
Jul 26, 2024
Granted
Sep 22, 2026
Inventors
4
Claims
13

Classified under

H05K 7/1417 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.