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SamsungGranted patentChips & hardwareInterest 4/10

Samsung patents phone case with hidden metal pattern for better signal

Samsung has been granted a patent for an electronic device housing that features a specific metal layer embedded within a textured surface. This design uses a conductive material placed in a trench between two curved sections of the case, covered by a protective coating, to manage radio signals.

Why it mattersThis design aims to improve how antennas work in devices with curved edges, which is a common challenge in modern smartphone manufacturing.

In the filing’s own words

An example housing of an electronic device may include a body including a first portion having a first curvature, and a second portion having a second curvature; an outer plating layer comprising a conductive material and disposed on an outer surface of the body unit to be spaced by a predetermined interval from a boundary between the first portion and the second portion; and a coating layer which is disposed on the outer surface of the body to cover the plating layer.

What exactly they claim (claim 1)

1. An electronic device comprising: a housing at least partially forming an exterior of the electronic device, the housing comprising: a body comprising a first portion having a first curvature and a second portion having a second curvature different from the first curvature, and having an outer surface on which a trench is formed, the trench; comprising: a valley that is concave with respect to the outer surface of the body, and a peak that is convex with respect to the outer surface of the body, the peak of the trench including a truncated portion obtained by removing a portion of the peak, an outer plating layer comprising a conductive material and disposed in the trench of the body to be spaced apart by a predetermined interval from a boundary between the first portion and the second portion; and a coating layer disposed on the outer surface of the body to cover the outer plating layer.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
Housing comprising plating layer and electronic device comprising housing
Patent number
US12745358B2
Application number
18473559
Filed
Sep 25, 2023
Granted
Sep 22, 2026
Inventors
2
Claims
14

Classified under

H05K 5/0243 Electricity & electronicsH04M 1/0202 Electricity & electronicsH05K 5/0018 Electricity & electronicsH05K 5/0086 Electricity & electronicsH05K 5/04 Electricity & electronicsH04M 1/026 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.