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SamsungGranted patentChips & hardwareInterest 3/10

Samsung patents circuit board design with mixed direct and wire connections

This patent describes an electronic device layout using a central interposer board with holes called vias to connect two separate circuit boards. One board connects its power circuit directly to a via, while the other uses a thin wire to reach a different via, allowing for flexible routing of electrical signals.

Why it mattersThis is a specific engineering method for connecting internal components, which may help manufacturers arrange parts more efficiently inside devices, though it does not describe a new consumer feature.

In the filing’s own words

An electronic device including an interposer printed circuit board (PCB) may comprise: an interposer PCB including at least two vias; a first PCB including a first direct connection unit including a power supply circuit and configured to directly connect the power supply circuit to a first via, and a first extension connection unit comprising a conductive material configured to connect a second via through a wire extending from the first direct connection unit; and a second PCB including a second direct connection unit including a load circuit and configured to directly connect the load circuit to the second via, and a second extension connection unit comprising a conductive material configured to connect the first via through a wire extending from the second direct connection unit.

What exactly they claim (claim 1)

1. An electronic device comprising: an interposer printed circuit board (PCB) comprising at least two vias; a first PCB comprising a first direct connection unit comprising a power supply circuit and configured to directly connect the power supply circuit to a first via, and a first extension connection unit comprising a conductive material configured to connect a second via through a wire extending from the first direct connection unit; and a second PCB comprising a second direct connection unit comprising a load circuit and configured to directly connect the load circuit to the second via, and a second extension connection unit comprising a conductive material configured to connect the first via through a wire extending from the second direct connection unit.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
Electronic device comprising interposer printed circuit board
Patent number
US12745349B2
Application number
18792851
Filed
Aug 2, 2024
Granted
Sep 22, 2026
Inventors
3
Claims
15

Classified under

H05K 1/144 Electricity & electronicsH05K 1/145 Electricity & electronicsH05K 2201/096 Electricity & electronicsH05K 2201/10378 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.