Samsung patents chip method to pack more data into electrical signals
This patent describes a semiconductor device that sends data using multi-level signals, which carry more information per pulse than simple on/off switches. It uses an encoder to add specific parity bits and calculate the best signal shape to ensure the data is transmitted accurately.
In the filing’s own words
Disclosed is a semiconductor device transmitting a multi-level signal including: an encoder encoding user data into encoded data; and a transmission driver converting the encoded data into a multi-level signal. The encoder includes: a bit adder generating a codeword by adding at least one shaping parity bit to the user data; an encoding operator generating candidate encoded data by performing an encoding operation on the codeword; a metric operator calculating metric values by using a metric operation equation for the candidate encoded data; and a metric searcher searching for the metric values to select the encoded data from the candidate encoded data and provide the selected encoded data to the transmission driver.
What exactly they claim (claim 1)
1. A semiconductor device comprising: an encoder configured to encode user data into encoded data; and a transmission driver configured to convert the encoded data into a multi-level signal, wherein the encoder is configured to: generate a plurality of codewords by adding a corresponding plurality of different sets of at least one shaping parity bit to the user data; generate a plurality of candidate encoded data by performing an encoding operation on the plurality of codewords; calculate metric values based on the plurality of candidate encoded data using a metric operation equation; and select the encoded data from the plurality of candidate encoded data based on the metric values, and provide the encoded data to the transmission driver.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor device using multi-level signaling and coding method thereof
- Patent number
- US12744620B2
- Application number
- 18793395
- Filed
- Aug 2, 2024
- Granted
- Sep 22, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H04L 1/0057 Electricity & electronicsH04L 25/4917 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.