Samsung patents antenna design using air gaps in adhesive
Samsung has been granted a patent for a wireless communication module that connects a metal plate to a calibration board using a special conductive adhesive. This adhesive contains small air gaps aligned with specific signal lines to improve electrical connections within the device.
In the filing’s own words
The disclosure relates to a fifth generation (5G) or pre-5G communication system supporting higher data rates after a fourth generation (4G) communication system such as Long Term Evolution (LTE). A module in a wireless communication system is provided. The module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a Radio Frequency (RF) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. The conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. The conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.
What exactly they claim (claim 1)
1. A module in a wireless communication system, the module comprising: a metal plate coupled to an antenna substrate; a calibration substrate; and a conductive adhesive material electrically coupling the metal plate and the calibration substrate, wherein the conductive adhesive material comprises an air gap formed corresponding to a signal line included in the calibration substrate.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Antenna structure and electronic device including the same
- Patent number
- US12744328B2
- Application number
- 18819279
- Filed
- Aug 29, 2024
- Granted
- Sep 22, 2026
- Inventors
- 8
- Claims
- 20
Classified under
H01Q 21/0006 Electricity & electronicsH01Q 1/246 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.