SamsungGranted patentChips & hardwareInterest 2/10

Samsung patents chip glue using a specific chemical compound

Samsung has secured a patent for a semiconductor package that uses a non-conductive film to bond different parts of a chip together. This film contains a specific chemical known as a dibenzocyclooctadiene (DBCOD)-based compound, which acts as a flux during the bonding process.

Why it mattersThis is a routine improvement to chip manufacturing materials that helps ensure components stick together correctly, but it is unlikely to change how everyday devices work.

In the filing’s own words

A semiconductor package includes a buffer die, a first core die disposed on the buffer die, and a non-conductive film (NCF) disposed between the buffer die and the first core die so that the buffer die and the first core die are bonded to each other, wherein the NCF includes a dibenzocyclooctadiene (DBCOD)-based compound.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a buffer die; a first core die disposed on the buffer die; and a non-conductive film (NCF) disposed between the buffer die and the first core die so that the buffer die and the first core die are bonded to each other, wherein the NCF comprises a dibenzocyclooctadiene (DBCOD)-based compound, and wherein the NCF comprises a flux, and the flux comprises the DBCOD-based compound.

Facts

Company: Samsung (Samsung Electronics Co., Ltd.)
Official title: Semiconductor package with a non-conductive film having a flux comprising a dibenzocyclooctadiene (DBCOD)-based compound
Patent number: US12740481B2
Application number: 18214124
Filed: Jun 26, 2023
Granted: Sep 15, 2026
Inventors: 2
Claims: 12

Classified under

H10W 90/00 Electricity & electronicsH10W 72/354 Electricity & electronicsH10W 74/15 Electricity & electronicsH10W 90/722 Electricity & electronicsH10W 90/732 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.