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SamsungGranted patentChips & hardwareInterest 4/10

Samsung patents chip packaging method using a flexible insulating bend

Samsung describes a way to build semiconductor packages by adding an insulating frame to a carrier substrate before applying a cover layer. The final package features a specific insulating bend that touches both the side and top of the main protective film covering the chip.

Why it mattersThis filing details a specific structural improvement in how chips are sealed and protected during manufacturing, which is a routine but essential part of making modern processors.

In the filing’s own words

A method of manufacturing a semiconductor package includes adding an insulating frame to a surface of a carrier substrate, wherein the insulating frame covers a side surface of a first metal layer on the surface of the carrier substrate and bringing a cover insulating layer into contact with the insulating frame and the first metal layer, wherein the cover insulating layer covers at least one semiconductor chip.

What exactly they claim (claim 1)

1. A semiconductor package, comprising: a redistribution structure comprising at least one redistribution layer and at least one redistribution insulating layer alternately stacked; a semiconductor chip on an upper surface of the redistribution structure and electrically connected to the at least one redistribution layer; a cover insulating layer on the upper surface of the redistribution structure and contacting and covering a side surface of the semiconductor chip, wherein the cover insulating layer is configured as a single build-up film layer; and an insulating bend partially contacting a portion of an outer surface of the cover insulating layer and partially contacting a portion of an upper surface of the cover insulating layer.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Semiconductor package manufacturing method and semiconductor package
Patent number
US12740470B2
Application number
18323680
Filed
May 25, 2023
Granted
Sep 15, 2026
Inventors
4
Claims
20

Classified under

H10W 74/117 Electricity & electronicsH10W 42/121 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/019 Electricity & electronicsH10W 74/121 Electricity & electronicsH10W 90/724 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.