OpenAI patents chip package design to prevent warping
OpenAI has been granted a patent for a semiconductor package that uses a stiffener ring with varying thickness to reduce warpage. The ring surrounds the chip and features sections of different stiffness, created by changing the material's thickness in a stepped or tapered manner.
In the filing’s own words
A semiconductor package includes a substrate, a die mounted on the substrate, and a stiffener ring mounted on the substrate and surrounding at least a portion of the die. The stiffener ring includes at least a first portion and a second portion circumferentially disposed along a perimeter of the stiffener ring. The first portion is characterized by a first effective stiffness, and the second portion is characterized by a second effective stiffness different from the first effective stiffness.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a substrate; a die mounted on the substrate; and a stiffener ring mounted on the substrate and surrounding at least a portion of the die, the stiffener ring comprising at least a first portion and a second portion circumferentially disposed along a perimeter of the stiffener ring, wherein the first portion is characterized by a first effective stiffness, and the second portion is characterized by a second effective stiffness different from the first effective stiffness, wherein a difference between the first effective stiffness and the second effective stiffness is established by a varying thickness profile between the first portion and the second portion, and wherein the first portion is characterized by a first thickness, and the second portion is characterized by a second thickness different from the first thickness, and wherein a transition between the first thickness and the second thickness is a stepped transition or a tapered transition.
Facts
- Company
- OpenAI (OpenAI OpCo, LLC.)
- Official title
- Mitigating semiconductor package warpage using improved stiffener ring
- Patent number
- US12740421B1
- Application number
- 19545955
- Filed
- Feb 20, 2026
- Granted
- Sep 15, 2026
- Inventors
- 2
- Claims
- 17
Classified under
H10W 42/121 Electricity & electronicsMore from OpenAI in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.