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Samsung patents chip cooling using suspended liquid channels

Samsung has been granted a patent for a semiconductor cooling system that uses a liquid coolant to absorb heat from a chip. The design features a 'wick' structure suspended inside the cooling channel to help move the liquid along the walls using capillary forces.

Why it mattersThis design aims to improve how heat is removed from computer chips, which is a standard engineering challenge for keeping electronics running efficiently.

In the filing’s own words

A semiconductor device includes: a semiconductor chip; a cooling channel configured to allow a coolant to (i) flow in liquid phase and (ii) absorb heat generated by the semiconductor chip during operation; and a wick structure configured to generate a capillary force for moving the coolant in the liquid phase along a wall surface of the cooling channel. The wick structure includes a suspended wick structure that is disposed apart from the wall surface by a capillary distance.

What exactly they claim (claim 1)

1. A semiconductor device comprising: a semiconductor chip; a cooling channel configured to allow a coolant to (i) flow in liquid phase and (ii) absorb heat generated by the semiconductor chip during operation; and a wick structure configured to generate a capillary force for moving the coolant in the liquid phase along a wall surface of the cooling channel, wherein the wick structure comprises a suspended wick structure that is disposed apart from the wall surface by a capillary distance, wherein the cooling channel is formed by recessing an upper surface of the semiconductor chip and comprises: a bottom disposed in a horizontal direction parallel to an upper surface of the semiconductor chip; and a side wall disposed in a vertical direction, the side wall connecting the upper surface of the semiconductor chip and the bottom of the cooling channel to each other, wherein the suspended wick structure comprises a first wick structure that is disposed apart from the side wall of the cooling channel.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Semiconductor device with 2-phase cooling structure
Patent number
US12740415B2
Application number
18514514
Filed
Nov 20, 2023
Granted
Sep 15, 2026
Inventors
3
Claims
19

Classified under

H10W 40/73 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/288 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.