Samsung patents chip design with a specific metal connection structure
Samsung has been granted a patent for a specific way to build the tiny connections inside computer chips. The design uses a metal pillar to link two layers of wiring, surrounded by a protective barrier layer that extends slightly above the top wire.
In the filing’s own words
Integrated circuit devices and methods of forming the same are provided. The integrated circuit devices may include a lower metal wire, an upper metal wire on the lower metal wire, a metal via between the lower metal wire and the upper metal wire, the metal via including a lower surface and an upper surface that respectively contact the lower metal wire and the upper metal wire, and a barrier layer extending on a side surface of the metal via. An upper portion of the barrier layer may extend upwardly beyond a lower surface of the upper metal wire.
What exactly they claim (claim 1)
1. An integrated circuit device comprising: a lower metal wire; an upper metal wire on the lower metal wire; a metal via between the lower metal wire and the upper metal wire, the metal via comprising a lower surface that contacts the lower metal wire and an upper surface that directly contacts the upper metal wire; and a barrier layer extending on a side surface of the metal via, wherein an upper portion of the barrier layer extends upwardly beyond a lower surface of the upper metal wire.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Integrated circuit devices including a conductive via and methods of forming the same
- Patent number
- US12740395B2
- Application number
- 18459894
- Filed
- Sep 1, 2023
- Granted
- Sep 15, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 20/42 Electricity & electronicsH10W 20/039 Electricity & electronicsH10W 20/063 Electricity & electronicsH10W 20/425 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.