Samsung patents 2D material chip design for better contact
Samsung describes a semiconductor device that uses a single-atom-thick layer of material called a transition metal dichalcogenide (TMD) as its main channel. To improve performance, the design adds a specific contact layer made of a metallic 2D material that bonds directly with the channel and the source/drain electrodes.
In the filing’s own words
A semiconductor device includes a semiconductor channel region on a substrate, and a contact layer that contacts a first side of the channel region. The channel region may include a transition metal dichalcogenide (TMD) monolayer as a semiconductor layer. The contact layer includes a first transition metal and a first chalcogen element bonded to the first transition metal. A gate structure is provided on the channel region, and a source/drain layer is provided that contacts the contact layer. The source/drain layer includes a metal that forms a covalent bond with the first transition metal within the contact layer.
What exactly they claim (claim 1)
1. A semiconductor device, comprising: a channel region on a substrate, said channel region including a semiconducting 2-dimensional material; a contact layer contacting a side of the channel region, said contact layer including a metallic 2-dimensional material, which comprises a first transition metal and a first chalcogen element bonded to the first transition metal; a gate structure on the channel region; and a source/drain layer contacting the contact layer, said source/drain layer comprising a metal that forms a covalent bond with the first transition metal within the contact layer.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Semiconductor switching devices with enhanced performance using 2-dimensional materials
- Patent number
- US12740114B2
- Application number
- 18148657
- Filed
- Dec 30, 2022
- Granted
- Sep 15, 2026
- Inventors
- 1
- Claims
- 10
Classified under
H10D 62/235 Electricity & electronicsH10D 62/151 Electricity & electronicsH10D 62/80 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.