Samsung patents 3D chip design with wider upper layers
Samsung has been granted a patent for a semiconductor device structure that stacks memory and processing components vertically. The design features a peripheral section that is wider at the top than at the bottom, sitting alongside the main memory cells.
In the filing’s own words
A semiconductor device is provided. The semiconductor device includes: a lower structure including a bit line; a cell semiconductor body vertically overlapping the bit line, on the lower structure; a peripheral semiconductor body including a portion disposed on a same level as at least a portion of the cell semiconductor body, on the lower structure; and a peripheral gate on the peripheral semiconductor body, wherein the peripheral semiconductor body includes a lower region having a first width and an upper region having a second width, greater than the first width on the lower region.
What exactly they claim (claim 1)
1. A semiconductor device, comprising: a lower structure including a bit line; a cell semiconductor body on the lower structure and vertically overlapping the bit line; a peripheral semiconductor body on the lower structure, the peripheral semiconductor body including a portion disposed at a same level as at least a portion of the cell semiconductor body; and a peripheral gate on the peripheral semiconductor body, wherein the peripheral semiconductor body includes a lower region having a first width and an upper region having a second width, wherein the upper region is on the lower region, and wherein the second width is greater than the first width.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor device
- Patent number
- US12740055B2
- Application number
- 18518293
- Filed
- Nov 22, 2023
- Granted
- Sep 15, 2026
- Inventors
- 9
- Claims
- 20
Classified under
H10B 12/50 Electricity & electronicsH10B 12/09 Electricity & electronicsH10B 12/315 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.