Samsung patents a stepped ring design for chip-making machines
Samsung has been granted a patent for a specific shape of a 'focus ring,' a component used in machines that process silicon wafers to make computer chips. The design features a ring with a stepped inner wall and an angled outer wall, which helps control how gas flows or particles move inside the machine during the manufacturing process.
In the filing’s own words
A substrate processing apparatus includes a focus ring, the focus ring includes a central axis that extends in a first direction, a top surface having a first inner diameter, a bottom surface having a second inner diameter that is smaller than the first inner diameter, and an inner lateral surface between the top surface and the bottom surface, the inner lateral surface including a first inner lateral surface and a second inner lateral surface, where the second inner lateral surface extends downward from the first inner lateral surface and a first angle between the first inner lateral surface and a line corresponding to the first direction is different from a second angle between the second inner lateral surface and the line corresponding to the first direction.
What exactly they claim (claim 1)
1. A substrate processing apparatus, comprising: a focus ring, wherein the focus ring comprises: a central axis that extends in a first direction; a top surface having a first inner diameter; a bottom surface having a second inner diameter that is greater than the first inner diameter; an inner lateral surface between the top surface and the bottom surface, the inner lateral surface comprising a first inner lateral surface and a second inner lateral surface; and an outer lateral surface comprising a first outer lateral surface and a second outer lateral surface that extends downward in the first direction from a bottom of the first outer lateral surface, wherein the second inner lateral surface extends downward from the first inner lateral surface, wherein a first angle between the first inner lateral surface and a line corresponding to the first direction is different from a second angle between the second inner lateral surface and the line corresponding to the first direction, wherein the first outer lateral surface is parallel to the first direction, and wherein a third angle between the second outer lateral surface and the line corresponding to the first direction is an acute angle.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Focus ring, substrate processing apparatus including the same, and semiconductor fabrication method using the same
- Patent number
- US12738462B2
- Application number
- 18211887
- Filed
- Jun 20, 2023
- Granted
- Sep 15, 2026
- Inventors
- 1
- Claims
- 19
Classified under
H01J 37/32642 Electricity & electronicsH10P 72/72 Electricity & electronicsH10P 72/7612 Electricity & electronicsH10P 72/7624 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.