Samsung patents chemical mix for making finer chip patterns
Samsung has been granted a patent for a specific liquid mixture used in the manufacturing of computer chips. The formula includes a special polymer that changes how water sits on its surface, which helps create precise designs during the chip-making process.
In the filing’s own words
A semiconductor photoresist composition and a method of forming patterns, the composition includes an acid reactive polymer; a resin additive including a block copolymer; a photo acid generator; a photo-decomposable quencher; and a solvent, wherein the block copolymer includes an A-block and a B-block, a water contact angle of a polymer film consisting of the A-block is greater than about 50° and less than or equal to about 100°, and a water contact angle of a polymer film consisting of the B-block is greater than about 0° and less than or equal to about 50°.
What exactly they claim (claim 1)
1. A semiconductor photoresist composition, comprising: an acid reactive polymer; a resin additive including a block copolymer; a photo acid generator; a photo-decomposable quencher; and a solvent, wherein: the block copolymer includes an A-block and a B-block, a water contact angle of a polymer film consisting of the A-block is greater than about 50° and less than or equal to about 100°, and a water contact angle of a polymer film consisting of the B-block is greater than about 0° and less than or equal to about 50°.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor photoresist composition and method of forming patterns using the composition
- Patent number
- US12736878B2
- Application number
- 18238662
- Filed
- Aug 28, 2023
- Granted
- Sep 15, 2026
- Inventors
- 3
- Claims
- 20
Classified under
G03F 7/039 Physics & computingC08L 53/00 Chemistry & metalsG03F 7/0045 Physics & computingG03F 7/038 Physics & computingH10P 76/202 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.