Samsung patents machine that polishes chip samples for easier inspection
This patent describes a machine that prepares thin slices of semiconductor material for microscopic analysis. It uses a rotating polishing plate and water to grind the sample, automatically adjusting the angle if the surface is not smooth enough.
In the filing’s own words
There is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. The method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (DI) water to an upper surface of a polishing plate through a DI water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.
What exactly they claim (claim 1)
1. A method for preparing analytical semiconductor samples, the method comprising: mounting the analytical semiconductor samples to a holder; rotating, through a rotatable support, a polishing plate; discharging deionized (DI) water to an upper surface of the polishing plate through a DI water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plate during the rotating; determining whether a desired viewing surface of the analytical semiconductor samples, with respect to a viewing surface image of the ground analytical semiconductor samples, has been acquired after the grinding of the analytical semiconductor samples; determining a change of at least one of a tilt direction or a tilt angle based on a determination that the desired viewing surface of the analytical semiconductor samples has not been acquired; grinding the analytical semiconductor samples using the changed at least one of the tilt direction or the tilt angle; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Apparatus for manufacturing analytical semiconductor samples and method for manufacturing analytical semiconductor samples by using the same
- Patent number
- US12736446B2
- Application number
- 18454381
- Filed
- Aug 23, 2023
- Granted
- Sep 15, 2026
- Inventors
- 7
- Claims
- 6
Classified under
G01N 1/32 Physics & computingB24B 7/228 Operations & transportMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.