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Samsung patents coating for chip polishing tools

Samsung has been granted a patent for a specific chemical coating used in the manufacturing of computer chips. The coating contains a structure that allows it to bond strongly to surfaces, which helps in the chemical mechanical polishing step where wafers are smoothed under pressure.

Why it mattersThis is a routine improvement to the internal machinery used to make semiconductors, ensuring smoother surfaces for high-quality chips.

In the filing’s own words

A membrane coating compound for a chemical mechanical polishing process, a membrane structure for a chemical mechanical polishing process, and a polishing apparatus for a chemical mechanical polishing process in which a wafer is holdable under pressure on the polishing apparatus, the membrane coating compound includes a functional group capable of hydrogen bonding.

What exactly they claim (claim 1)

1. A membrane coating compound for a chemical mechanical polishing (CMP) process, the membrane coating compound comprising: a functional group capable of hydrogen bonding, wherein the functional group capable of hydrogen bonding includes a functional group having a catechol structure.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Membrane coating compound for chemical mechanical polishing process, membrane including the same, and polishing apparatus including the same
Patent number
US12734637B2
Application number
18219222
Filed
Jul 7, 2023
Granted
Sep 15, 2026
Inventors
3
Claims
20

Classified under

B24B 37/24 Operations & transportB24B 37/22 Operations & transport
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.