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Samsung patents chip package design with trenches for better protection

Samsung describes a semiconductor package where two chips sit on a central board area, surrounded by trenches filled with a protective mold layer. This mold wraps around the chips and extends down through the board's edges, creating a flat bottom surface covered by a protective film.

Why it mattersThis design improves the structural integrity and protection of advanced chip packages, which is standard practice in high-end electronics manufacturing.

In the filing’s own words

A semiconductor package may include a circuit board, an interposer structure on the circuit board, a mold layer, and a first semiconductor chip and a second semiconductor chip spaced apart from each other in a first direction on a center region of the interposer structure and electrically connected to the interposer structure. The interposer structure may include a plurality of trenches in an edge region of the interposer structure and extending through the interposer structure. The mold layer may be in the plurality of trenches and may wrap the first and second semiconductor chips. The mold layer may include a penetrating portion in the plurality of trenches and a stack portion on the interposer structure. A bottom surface of the penetrating portion of the mold layer may be on a same plane as a bottom surface of the interposer structure.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a circuit board; an interposer structure on the circuit board, the interposer structure including an edge region and a center region defined by the edge region, the edge region including a plurality of trenches, the plurality of trenches extending through the interposer structure; a first semiconductor chip and a second semiconductor chip on the center region of the interposer structure, the first semiconductor chip and the second semiconductor chip being electrically connected to the interposer structure, and the first semiconductor chip and the second semiconductor chip being spaced apart from each other in a first direction; a mold layer in the plurality of trenches; and a passivation film on a bottom surface of the interposer structure, wherein the mold layer wraps the first semiconductor chip and the second semiconductor chip, the mold layer includes a penetrating portion in the plurality of trenches and a stack portion on the interposer structure, a bottom surface of the penetrating portion of the mold layer is on a same plane as the bottom surface of the interposer structure, and the passivation film covers the bottom surface of the mold layer.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
Semiconductor package
Patent number
US12733555B2
Application number
18483211
Filed
Oct 9, 2023
Granted
Sep 8, 2026
Inventors
2
Claims
18

Classified under

H10W 90/00 Electricity & electronicsH10B 80/00 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/111 Electricity & electronicsH10W 72/823 Electricity & electronicsH10W 90/721 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.