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SamsungGranted patentChips & hardwareInterest 3/10

Samsung patents stacked chip design with protruding connection pads

Samsung describes a method for stacking two semiconductor chips vertically to save space. The top chip connects to the bottom one using a specific pad design where a small bump on the upper pad fits into the lower one to ensure a tight electrical connection.

Why it mattersThis technique helps manufacturers build denser, more compact processors, which is a standard step in making smaller and more efficient computer components.

In the filing’s own words

A semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode passing through the first semiconductor layer in a vertical direction, and a first bonding pad connected to the first through-electrode, and a second semiconductor chip including a second semiconductor layer on the first semiconductor chip, a wiring structure between the second semiconductor layer and the first semiconductor chip, a wiring pad connected to the wiring structure below the wiring structure, and a second bonding pad connected to the wiring pad below the wiring pad and in contact with the first bonding pad, wherein the second bonding pad includes a protrusion protruding toward the wiring pad.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a first semiconductor chip including: a first semiconductor layer, a first through-electrode passing through the first semiconductor layer in a vertical direction, and a first bonding pad connected to the first through-electrode; and a second semiconductor chip including: a second semiconductor layer, the second semiconductor chip disposed on the first semiconductor chip, a wiring structure between the second semiconductor layer and the first semiconductor chip, a wiring pad connected to the wiring structure below the wiring structure, and a second bonding pad connected to the wiring pad and disposed below the wiring pad, wherein the second bonding pad contacts the first bonding pad and includes a top portion and a protrusion protruding from the top portion into the wiring pad.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
Semiconductor package and method of manufacturing the same
Patent number
US12733546B2
Application number
18212461
Filed
Jun 21, 2023
Granted
Sep 8, 2026
Inventors
3
Claims
20

Classified under

H10W 90/00 Electricity & electronicsH10W 20/42 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/635 Electricity & electronicsH10W 70/60 Electricity & electronicsH10W 72/853 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.