Samsung patents chip package with trapezoidal grooves to hold adhesive
Samsung has been granted a patent for a semiconductor package design that uses a cap to cover a chip. The bottom of this cap features small, trapezoidal grooves that are filled with an adhesive layer to secure the cap to the base.
In the filing’s own words
Disclosed is a semiconductor package comprising a package substrate having a mount region and a peripheral region that surrounds the mount region, a semiconductor device on the mount region of the package substrate, a package cap on the peripheral region of the package substrate and including a partition portion that surrounds the semiconductor device and an extension portion that covers the semiconductor device, and an adhesive layer between the package substrate and a bottom surface of the package cap. The bottom surface of the package cap has a trench. The trench has a trapezoidal cross-section whose width decreases in a direction receding from the bottom surface of the package cap. The adhesive layer is in contact with a top surface of the package substrate and the bottom surface of the package cap. The adhesive layer fills the trench.
What exactly they claim (claim 1)
1. A semiconductor package, comprising: a package substrate having a mount region and a peripheral region that surrounds the mount region; a semiconductor device on the mount region of the package substrate; a package cap on the peripheral region of the package substrate, the package cap including a partition portion that surrounds the semiconductor device and an extension portion that covers the semiconductor device; and an adhesive layer between the package substrate and a bottom surface of the package cap, wherein the bottom surface of the package cap has a plurality of trenches, wherein, for each trench of the plurality of trenches: the trench has a trapezoidal cross-section whose width decreases in a direction receding from the bottom surface of the package cap, the trench has a first surface that is farthest away from the bottom surface of the package cap, a width of the first surface of the trench is smaller than a width of the trench at the bottom surface of the package cap, and the adhesive layer fills the trench, wherein the adhesive layer is in contact with a top surface of the package substrate and the bottom surface of the package cap, and wherein a depth of a first trench of the plurality of trenches is greater than a depth of a second trench of the plurality of trenches.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Semiconductor package including package cap
- Patent number
- US12733488B2
- Application number
- 17874404
- Filed
- Jul 27, 2022
- Granted
- Sep 8, 2026
- Inventors
- 1
- Claims
- 13
Classified under
H10W 40/22 Electricity & electronicsH10F 39/804 Electricity & electronicsH10W 42/20 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/401 Electricity & electronicsH10F 39/809 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.