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SamsungGranted patentChips & hardwareInterest 3/10

Samsung patents chip package design with metal layer for better cooling

Samsung has been granted a patent for a semiconductor package that improves heat management. The design places a heat dissipation plate on top of the chip, featuring a specific metal layer and thermal material to help move heat away from the processor.

Why it mattersThis is a routine hardware improvement that helps keep computer chips running at optimal temperatures by enhancing how heat is transferred from the processor to the cooling system.

In the filing’s own words

Provided is a semiconductor package including a first substrate, a first chip structure on the first substrate, the first chip structure including at least one chip, a heat dissipation member on the first chip structure, the heat dissipation member including a heat dissipation plate including a first surface facing the first chip structure and a second surface opposite to the first surface and a seed metal layer on the second surface of the heat dissipation plate, and a metal thermal interfacial material (TIM) on the seed metal layer.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a first substrate; a first chip structure on the first substrate, the first chip structure comprising at least one chip; a heat dissipation member on the first chip structure, the heat dissipation member comprising: a heat dissipation plate comprising a first surface facing the first chip structure and a second surface opposite to the first surface; and a seed metal layer on the second surface of the heat dissipation plate; a metal thermal interfacial material (TIM) on the seed metal layer; and a first adhesive layer between the first chip structure and the heat dissipation member.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Semiconductor package
Patent number
US12733487B2
Application number
18243437
Filed
Sep 7, 2023
Granted
Sep 8, 2026
Inventors
2
Claims
19

Classified under

H10W 40/10 Electricity & electronicsH10B 80/00 Electricity & electronicsH10W 40/70 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 72/07354 Electricity & electronicsH10W 72/347 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.