Samsung patents substrate with built-in wire to detect physical damage
Samsung has been granted a patent for a circuit board substrate that includes a test circuit designed to check for physical damage. The design features a wire that runs around the outer edge of the board, connecting two contact points so that a tester can verify the board's integrity by checking if the circuit is closed.
In the filing’s own words
Provided are a substrate including a test circuit capable of testing a damaged state thereof. The substrate includes a substrate body, and a test circuit arranged on at least one of an upper surface and a lower surface of the substrate body, wherein the test circuit includes two contact pads and at least one test wiring, the two contact pads being at an end portion of the substrate body and configured to contact two probe pins of a test element, the test wiring extending to surround an outer periphery portion of the substrate body and configured to connect the two contact pads to each other, and wherein, in an electrical test using the test element, when the test wiring is in a closed state, the substrate body is determined as normal, and when the test wiring is in an open state, the substrate body is determined as defective.
What exactly they claim (claim 1)
1. A substrate including a test circuit, the substrate comprising: a substrate body; and the test circuit on at least one of an upper surface and a lower surface of the substrate body, wherein the test circuit comprises two contact pads and at least one test wiring, the two contact pads being at an end portion of the substrate body and configured to contact two probe pins of a test element, the at least one test wiring extending to surround a first outer periphery portion of the substrate body and configured to connect the two contact pads to each other, the at least one test wiring being a single integral body, and in an electrical test using the test element, when the at least one test wiring is in a closed state, the substrate body is determined as normal, and when the at least one test wiring is in an open state, the substrate body is determined as defective.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Substrate including test circuit and substrate test apparatus including the substrate
- Patent number
- US12733460B2
- Application number
- 18364119
- Filed
- Aug 2, 2023
- Granted
- Sep 8, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10P 74/277 Electricity & electronicsG01R 31/2893 Physics & computingH10P 74/273 Electricity & electronicsH10W 90/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.