Samsung patents a sealed design for chip-making tools
The filing describes a specific mechanical structure for an electrostatic chuck, a device used to hold silicon wafers in place during chip manufacturing. It details how a ceramic part is glued to a metal base and sealed with a separate component that fits against an angled surface to ensure a tight connection.
In the filing’s own words
An electrostatic chuck comprising; an electrostatic chuck body configured to have a step protruding from a lower end thereof in a radial direction, an adhesive layer on an upper surface of the electrostatic chuck body, a ceramic puck configured to be adhered to the adhesive layer and configured to have an edge protruding from the upper surface of the electrostatic chuck body, and a sealing member on a lower portion of an edge of the ceramic puck. The electrostatic chuck body is provided with an installation portion configured to have an inclined surface, and the sealing member is configured to be in contact with the inclined surface.
What exactly they claim (claim 1)
1. An electrostatic chuck comprising: an electrostatic chuck body having a step protruding from a lower end thereof in a radial direction; an adhesive layer on an upper surface of the electrostatic chuck body; a ceramic puck adhered to the adhesive layer and having an edge protruding from the upper surface of the electrostatic chuck body; and a sealing member on a lower edge portion of the ceramic puck, wherein the electrostatic chuck body is provided with an installation portion having an inclined surface, the sealing member is in contact with the inclined surface, wherein the sealing member is in contact with a bottom surface of the ceramic puck, and wherein the sealing member is a separate component from the adhesive layer.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Electrostatic chuck
- Patent number
- US12733444B2
- Application number
- 18621553
- Filed
- Mar 29, 2024
- Granted
- Sep 8, 2026
- Inventors
- 2
- Claims
- 17
Classified under
H10P 72/722 Electricity & electronicsH01J 37/32715 Electricity & electronicsH01J 2237/2007 Electricity & electronicsH01J 2237/334 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.