Samsung patents steam nozzle system for cleaning semiconductor wafers
Samsung has been granted a patent for a machine that cleans flat semiconductor substrates using a moving arm equipped with steam and gas nozzles. The device includes built-in sensors to monitor temperature and pressure, ensuring the cleaning process is consistent and controlled.
In the filing’s own words
A substrate cleaning apparatus may include a steam injector configured to clean a substrate, a steam supplier configured to supply a steam, and a gas supplier configured to supply a gas. The steam injector may include a drive unit configured to move horizontally, a plate on the drive unit, and a plurality of nozzles on the plate. The plate may include a temperature sensor, a first pressure sensor, and a second pressure sensor. Each of the plurality of nozzles may be connected to the steam supplier and the gas supplier. The plurality of nozzles may be arranged in one direction from a planar viewpoint.
What exactly they claim (claim 1)
1. A substrate cleaning apparatus comprising: a steam injector configured to clean a substrate; a steam supplier configured to supply a steam; and a gas supplier configured to supply a gas, wherein the steam injector includes a drive unit configured to move horizontally, a plate on the drive unit, and a plurality of nozzles on the plate, the plate includes a temperature sensor, a first pressure sensor, and a second pressure sensor, each of the plurality of nozzles is connected to the steam supplier and the gas supplier, and the plurality of nozzles are arranged in a first direction from a planar viewpoint.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Apparatus of cleaning substrate, apparatus of semiconductor device and method for manufacturing a semiconductor package using the same
- Patent number
- US12733427B2
- Application number
- 18351754
- Filed
- Jul 13, 2023
- Granted
- Sep 8, 2026
- Inventors
- 2
- Claims
- 12
Classified under
H10P 72/0412 Electricity & electronicsH10P 72/0456 Electricity & electronicsH10P 72/0468 Electricity & electronicsH10P 72/0602 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.