Samsung patents method to sort tiny chips into grooves using a wiper
Samsung describes a way to place microscopic semiconductor chips into specific slots on a substrate. The process involves pouring a liquid mixture containing the chips onto the surface and using a special bar with a water-repelling wiper to sweep the chips into the correct positions.
In the filing’s own words
A micro semiconductor chip transfer method is provided and includes: preparing a transfer substrate including an upper portion having grooves formed therein; supplying, to the upper portion of the transfer substrate, a suspension including micro semiconductor chips and a liquid; and aligning the micro semiconductor chips in the grooves by sweeping, with an alignment bar that includes a hydrophobic wiper, an upper surface of the transfer substrate while the suspension is on the upper surface of the transfer substrate.
What exactly they claim (claim 1)
1. A micro semiconductor chip transfer method comprising: preparing a transfer substrate comprising an upper portion having grooves formed therein; supplying, to the upper portion of the transfer substrate, a suspension comprising micro semiconductor chips and a liquid; and aligning the micro semiconductor chips in the grooves by sweeping, with an alignment bar that comprises a hydrophobic wiper, an upper surface of the transfer substrate while the suspension is on the upper surface of the transfer substrate, wherein the aligning comprises moving, with the alignment bar, at least one of the micro semiconductor chips from the upper surface of the transfer substrate, outside of the grooves, into at least one of the grooves, and wherein the transfer substrate comprises a surface energy reduction pattern, and the surface energy reduction pattern comprises a plurality of convex patterns in an area between the grooves on the upper surface of the transfer substrate.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Micro semiconductor chip transfer method and micro semiconductor chip transfer device
- Patent number
- US12733294B2
- Application number
- 18433068
- Filed
- Feb 5, 2024
- Granted
- Sep 8, 2026
- Inventors
- 8
- Claims
- 20
Classified under
H10H 20/01 Electricity & electronicsH10P 72/0442 Electricity & electronicsH10P 72/16 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.