/Patent Tracker
SamsungGranted patentChips & hardwareInterest 4/10

Samsung patents image sensor design with three stacked layers

Samsung describes an image sensor structure that stacks three separate substrates to organize electronic components. It uses a middle layer to connect transistors to the light-sensitive area while placing capacitors on a lower layer to save space.

Why it mattersThis design helps manufacturers pack more components into a camera sensor, which could lead to smaller or more efficient camera modules in future devices.

In the filing’s own words

An image sensor may include a first substrate having first and second surfaces opposite to each other and including a floating diffusion region provided near the first surface, a second substrate provided on the first surface of the first substrate, an intermediate substrate disposed between the first and second substrates, a first transistor disposed on a bottom surface of the intermediate substrate, a contact pattern electrically connecting the first transistor to the floating diffusion region, an upper interconnection layer provided on a bottom surface of the intermediate substrate, a lower interconnection layer between the upper interconnection layer and the second substrate, conductive pads electrically connecting the upper and lower interconnection layers, and a capacitor disposed on the second substrate. The contact pattern may penetrate the intermediate substrate and may be in contact with the floating diffusion region. The capacitor may be closer to the second substrate than the conductive pads.

What exactly they claim (claim 1)

1. An image sensor, comprising: a first substrate having a bottom surface and a top surface, which are opposite to each other, the first substrate including a floating diffusion region at the bottom surface of the first substrate and within the first substrate; a second substrate below the bottom surface of the first substrate; an intermediate substrate between the first substrate and the second substrate; a first transistor on a bottom surface of the intermediate substrate; a contact pattern electrically connecting the first transistor to the floating diffusion region; an upper interconnection layer on the bottom surface of the intermediate substrate; a lower semiconductor chip below the upper interconnection layer, the lower semiconductor chip including: a lower interconnection layer, and the second substrate, wherein the lower interconnection layer is between the upper interconnection layer and the second substrate; a first conductive pad at a bottom surface of the upper interconnection layer, the first conductive pad being bonded to a second conductive pad at a top surface of the lower interconnection layer, wherein the first conductive pad and the second conductive pad electrically connect the upper interconnection layer to the lower interconnection layer; and a capacitor above the second substrate and below the upper interconnection layer, wherein the contact pattern penetrates the intermediate substrate and contacts the floating diffusion region, and wherein the capacitor is in the lower semiconductor chip and the capacitor is closer to the second substrate than the second conductive pad is to the second substrate.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Image sensor including three substrates
Patent number
US12733284B2
Application number
17897775
Filed
Aug 29, 2022
Granted
Sep 8, 2026
Inventors
1
Claims
20

Classified under

H10F 39/811 Electricity & electronicsH10F 39/8037 Electricity & electronicsH10F 39/8053 Electricity & electronicsH10F 39/8063 Electricity & electronicsH10F 39/807 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

More from Samsung in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.