Samsung patents flat T-coil design for integrated circuits
Samsung describes a method for building a T-coil, a component used to transmit or receive signals, directly into a chip's metal layer. The design uses two parallel metal patterns that act as both inductors and a capacitor, allowing the component to be flat and integrated into the circuit board.
In the filing’s own words
An integrated circuit includes a T-coil formed in a first metal layer, wherein the T-coil may include: a first inductor connected to a first terminal and a second terminal; and a second inductor connected to the second terminal and a third terminal, wherein the first inductor and the second inductor may include a first pattern and a second pattern, respectively, the first and second patterns extending parallel to each other in a first direction from the second terminal in the first metal layer, and wherein the first pattern and the second pattern may form a bridge capacitor of the T-coil.
What exactly they claim (claim 1)
1. An integrated circuit comprising: a first T-coil formed in a first metal layer; wherein the first T-coil comprises: a first inductor connected to a first terminal and a second terminal; a second inductor connected to the second terminal and a third terminal, wherein the first inductor comprises a first pattern in the first metal layer and the second inductor comprises a second pattern in the first metal layer, wherein the first pattern and the second pattern extend in parallel to each other in a first direction from the second terminal, and wherein the first pattern and the second pattern are configured to form a bridge capacitor of the first T-coil; and a second T-coil, wherein the second T-coil comprises; a third inductor and a fourth inductor, wherein the third inductor is connected to a fourth terminal and a fifth terminal and the fourth inductor is connected to the fifth terminal and a sixth terminal, wherein the third inductor and the fourth inductor are formed in the first metal layer.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Planar T-coil and integrated circuit including the same
- Patent number
- US12733264B2
- Application number
- 17856394
- Filed
- Jul 1, 2022
- Granted
- Sep 8, 2026
- Inventors
- 6
- Claims
- 20
Classified under
H10D 89/911 Electricity & electronicsH10D 1/20 Electricity & electronicsH10W 44/20 Electricity & electronicsH03H 7/0115 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.