/Patent Tracker
MicrosoftGranted patentChips & hardwareInterest 2/10

Microsoft patents screw design that holds parts inside device cases

Microsoft has been granted a patent for a specific way to attach internal parts to the outer shell of an electronic device. The design uses a 'dual screw assembly' where one screw goes into the case, and a second, smaller screw goes into the head of the first one to clamp a component in place.

Why it mattersThis is a routine mechanical improvement that likely helps engineers secure internal components more securely or with fewer parts, but it does not change how the device looks or functions for the user.

In the filing’s own words

An electronic device includes a device housing and a secondary component removably affixed to the device housing. A dual screw assembly is used to affix the secondary component to the device housing. The dual screw assembly includes a first screw inserted into a housing aperture of the device housing, such that a portion of the first screw extends into an interior of the device housing, and a second screw inserted into a screw aperture formed within a head of the first screw, such that at least a portion of the secondary component is positioned between a head of the second screw and the head of the first screw.

What exactly they claim (claim 1)

1. An electronic device, comprising: a device housing; a secondary component removably affixed to the device housing; and a dual screw assembly affixing the secondary component to the device housing, the dual screw assembly including: a first screw inserted into a housing aperture of the device housing, such that a portion of the first screw extends into an interior of the device housing; and a second screw inserted into a screw aperture formed within a head of the first screw, such that at least a portion of the secondary component is positioned between a head of the second screw and the head of the first screw.

Facts

Company
Microsoft (Microsoft Technology Licensing, LLC)
Official title
Dual-screw assembly for device housing
Patent number
US12733118B2
Application number
18905842
Filed
Oct 3, 2024
Granted
Sep 8, 2026
Inventors
4
Claims
20

Classified under

H05K 5/061 Electricity & electronicsH05K 5/0017 Electricity & electronicsH05K 5/13 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

More from Microsoft in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.