Samsung patents modem chip that adjusts signal decoding based on noise
Samsung has been granted a patent for a modem chip that measures the quality of a received wireless signal to decide how to process it. The chip calculates a signal-to-interference ratio and uses that number to pick between different mathematical methods for decoding the data. This allows the processor to choose a calculation mode that matches the current signal conditions.
In the filing’s own words
A modem chip includes a radio frequency integrated circuit (RFIC) configured to receive a signal including channel state information, and a processor configured to determine a signal to interference ratio (SIR) of the received signal based on the channel state information. The processor selects a log likelihood ratio (LLR) calculation mode among at least two LLR calculation modes that differently calculate an LLR of the received signal, by comparing the SIR with at least one threshold, and decodes the received signal by calculating the LLR of the received signal based on the selected LLR calculation mode.
What exactly they claim (claim 1)
1. A modem chip comprising: a radio frequency integrated circuit (RFIC) configured to receive a signal including channel state information; and a processor configured to: determine a signal to interference ratio (SIR) of the received signal based on the channel state information; select a log likelihood ratio (LLR) calculation mode among at least two LLR calculation modes that differently calculate an LLR of the received signal by comparing the SIR with at least one threshold; and decode the received signal by calculating the LLR of the received signal based on the selected LLR calculation mode.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Modem chip employing low complexity log likelihood ratio calculation and operating method thereof
- Patent number
- US12732292B2
- Application number
- 18980077
- Filed
- Dec 13, 2024
- Granted
- Sep 8, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H04B 17/382 Electricity & electronicsH04B 1/1027 Electricity & electronicsH04B 7/0854 Electricity & electronicsH04B 17/336 Electricity & electronicsH04L 27/3405 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.