Samsung patents chip design that translates memory data between dies
This patent describes a system where two separate computer chips (dies) connect via a specific interface. It includes a 'transaction converter' that changes how data is packaged so it can move efficiently between the memory and the chip's controller.
In the filing’s own words
An apparatus may include a die including a memory interface, a die-to-die (D2D) circuit comprising a D2D interface, and an intermediate section connected between the memory interface and the D2D interface, wherein the intermediate section comprises a transaction converter. The intermediate section may be configured to transfer data through the D2D interface using a protocol. The D2D interface may be configured to transfer data using flow control. The D2D interface may be configured to transfer data using a raw format.
What exactly they claim (claim 1)
1. An apparatus comprising: a first die comprising: a memory interface configured to transfer data using a memory transaction; a first die-to-die (D2D) circuit comprising a first D2D interface configured to transfer data using at least one transfer unit; and a transaction converter configured to convert between the memory transaction and the at least one transfer unit; and a second die comprising: a second D2D circuit comprising a second D2D interface connected to the first D2D interface; and a memory controller connected to the second D2D circuit and configured to communicate with the memory interface.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Systems, methods, and apparatus for accessing memory with die-to-die interfaces
- Patent number
- US12730560B2
- Application number
- 18935341
- Filed
- Nov 1, 2024
- Granted
- Sep 8, 2026
- Inventors
- 3
- Claims
- 20
Classified under
G06F 3/0611 Physics & computingG06F 3/0659 Physics & computingG06F 3/0673 Physics & computingMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.