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Samsung patents wafer sensor using spiral fiber to track heat

Samsung has been granted a patent for a temperature sensor designed for semiconductor wafers. It uses two bonded wafers with spiral grooves that hold optical fibers containing multiple temperature measurement points.

Why it mattersThis improves the precision of heat monitoring during chip manufacturing, which is a routine but critical step in producing reliable electronics.

In the filing’s own words

A wafer temperature sensor includes a first wafer, a second wafer, and a fiber bragg gratings (FBG)-type optical fiber, wherein the first wafer and the second wafer are bonded to each other, wherein at least one of a bonding surface of the first wafer and a bonding surface of the second wafer comprises a spiral groove, wherein the FBG-type optical fiber is in the spiral groove, and wherein the FBG-type optical fiber comprises a plurality of temperature measurement points in the spiral groove.

What exactly they claim (claim 1)

1. A wafer temperature sensor comprising: a first wafer, a second wafer, and a plurality of fiber bragg gratings (FBG)-type optical fibers, wherein a first surface of the first wafer and a first surface of the second wafer are bonded to each other, wherein at least one of the first surface of the first wafer and the first surface of the second wafer comprises a plurality of spiral grooves, wherein each FBG-type optical fiber, of the plurality of FBG-type optical fibers, is in a respective groove of the plurality of spiral grooves, and wherein the FBG-type optical fiber comprises a plurality of temperature measurement points in the spiral groove.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
Wafer temperature sensor including optical fiber, wafer temperature sensor system, and method of manufacturing wafer temperature sensor
Patent number
US12730014B2
Application number
18341804
Filed
Jun 27, 2023
Granted
Sep 8, 2026
Inventors
2
Claims
20

Classified under

G01K 11/3206 Physics & computing

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.