Sony patents camera sensor design that seals gaps in protective layers
Sony describes a structure for a light detection device, such as a camera sensor, where a chip is covered by a buried layer. The design includes a specific seam in that layer and adds a sealing layer on top to cover the gap and protect the components.
In the filing’s own words
A light detection device includes: a substrate including a light detection element; a chip provided for the substrate; a buried layer provided to cover the chip; a seam portion occurring in the buried layer and extending to a front surface of the buried layer; and a sealing layer provided to cover the buried layer and the seam portion.
What exactly they claim (claim 1)
1. A light detection device comprising: a substrate including a light detection element; a chip provided for the substrate; a buried layer provided to cover the chip; a seam portion occurring in the buried layer and extending to a front surface of the buried layer; and a sealing layer provided to cover the buried layer and the seam portion.
Facts
- Company
- Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- Official title
- LIGHT DETECTION DEVICE
- Publication number
- US20260334287A1
- Application number
- 19107713
- Filed
- Sep 7, 2023
- Published
- Oct 22, 2026
- Inventors
- 8
- Claims
- 61
Classified under
H10W 74/114 Electricity & electronicsH10F 39/8053 Electricity & electronicsH10F 39/8063 Electricity & electronicsH10F 39/809 Electricity & electronicsH10F 39/811 Electricity & electronicsH10W 74/01 Electricity & electronicsMore from Sony in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
