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Sony patents camera sensor design that seals gaps in protective layers

Patent drawing
Patent drawing from the official filing.

Sony describes a structure for a light detection device, such as a camera sensor, where a chip is covered by a buried layer. The design includes a specific seam in that layer and adds a sealing layer on top to cover the gap and protect the components.

Why it mattersThis is a routine improvement in how camera sensors are packaged and protected, which helps ensure the reliability of the hardware inside phones and cameras.

In the filing’s own words

A light detection device includes: a substrate including a light detection element; a chip provided for the substrate; a buried layer provided to cover the chip; a seam portion occurring in the buried layer and extending to a front surface of the buried layer; and a sealing layer provided to cover the buried layer and the seam portion.

What exactly they claim (claim 1)

1. A light detection device comprising: a substrate including a light detection element; a chip provided for the substrate; a buried layer provided to cover the chip; a seam portion occurring in the buried layer and extending to a front surface of the buried layer; and a sealing layer provided to cover the buried layer and the seam portion.

Facts

Company
Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title
LIGHT DETECTION DEVICE
Publication number
US20260334287A1
Application number
19107713
Filed
Sep 7, 2023
Published
Oct 22, 2026
Inventors
8
Claims
61

Classified under

H10W 74/114 Electricity & electronicsH10F 39/8053 Electricity & electronicsH10F 39/8063 Electricity & electronicsH10F 39/809 Electricity & electronicsH10F 39/811 Electricity & electronicsH10W 74/01 Electricity & electronics

More from Sony in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.