/Patent Tracker
SonyPatent applicationChips & hardwareInterest 3/10

Sony patents clear wiring layers to stop light loss in chips

Patent drawing
Patent drawing from the official filing.

Sony describes a method for building electronic components where the wires connecting different layers are made of transparent material. These clear wires pass through holes in an insulating layer to connect the bottom circuit to the top circuit without blocking light.

Why it mattersThis design helps prevent light from being absorbed by metal wires, which is important for chips that need to process or detect light signals.

In the filing’s own words

Light reduction in a wiring part connected to an optical device of an electronic device including the optical device is prevented. The electronic device includes an insulating layer, an interlayer connection wiring, and an upper layer wiring. The insulating layer is disposed adjacent to the lower layer wiring and includes a through hole. The interlayer connection wiring is a transparent wiring that is connected to the lower layer wiring in the through hole and is formed into a shape extending to a surface side of the insulating layer. The upper layer wiring is a transparent wiring that is stacked and connected to the interlayer connection wiring extending to the surface side of the insulating layer.

What exactly they claim (claim 1)

1. An electronic device comprising: an insulating layer disposed adjacent to a lower layer wiring, the insulating layer including a through hole; a transparent interlayer connection wiring connected to the lower layer wiring in the through hole, the interlayer connection wiring formed into a shape extending to a surface side of the insulating layer; and a transparent upper layer wiring stacked on and connected to the interlayer connection wiring extending to the surface side of the insulating layer.

Facts

Company
Sony (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Official title
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Publication number
US20260333992A1
Application number
19556773
Filed
Mar 4, 2026
Published
Oct 22, 2026
Inventors
11
Claims
20

Classified under

H10K 39/38 Electricity & electronicsH10K 39/32 Electricity & electronicsH10K 39/401 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

More from Sony in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.